发明名称 |
Stack assembly for implementing keypads on mobile computing devices |
摘要 |
A stack assembly for use with a mobile computing device. In one embodiment, the stack assembly includes an electrical contact layer, and actuation member layer, and an illumination layer. The electrical contact layer includes a plurality of contact elements. The actuation member layer includes a plurality of actuation members are, wherein each actuation member is aligned so that an axial movement of that member causes a corresponding one of the plurality of contact elements to actuate. The illumination layer is configured to emit light to the keypad. |
申请公布号 |
US9142369(B2) |
申请公布日期 |
2015.09.22 |
申请号 |
US200511080375 |
申请日期 |
2005.03.14 |
申请人 |
QUALCOMM Incorporated |
发明人 |
Yurochko Michael;Zarnowitz Arthur;Skillman Peter |
分类号 |
G06F3/02;H01H13/83;H01H13/85;H04M1/22 |
主分类号 |
G06F3/02 |
代理机构 |
Mahamedi Paradice LLP |
代理人 |
Mahamedi Paradice LLP |
主权项 |
1. A modular stack assembly for use as at least a part of a keypad for a mobile computing device, the stack assembly comprising:
an electrical contact layer on which a plurality of contact elements are provided; an actuation member layer on which a plurality of actuation members are provided, wherein each actuation member in the plurality of actuation members extends inward from a corresponding key structure of a key structure layer and is aligned so that an axial movement of that actuation member causes a corresponding one of the plurality of contact elements to actuate; and an illumination layer configured to emit light to the keypad, the illumination layer comprising a plurality of discrete light sources that are positioned underneath the actuation member layer and the key structure layer; wherein the electrical contact layer, the actuation member layer and the illumination layer are integrally combined to form at least a portion of the modular stack assembly; wherein the modular stack assembly is structured to be capable of being combined, as a single unit, with a housing of the mobile computing device during an assembly process for manufacturing the mobile computing device. |
地址 |
San Diego CA US |