发明名称 Stack assembly for implementing keypads on mobile computing devices
摘要 A stack assembly for use with a mobile computing device. In one embodiment, the stack assembly includes an electrical contact layer, and actuation member layer, and an illumination layer. The electrical contact layer includes a plurality of contact elements. The actuation member layer includes a plurality of actuation members are, wherein each actuation member is aligned so that an axial movement of that member causes a corresponding one of the plurality of contact elements to actuate. The illumination layer is configured to emit light to the keypad.
申请公布号 US9142369(B2) 申请公布日期 2015.09.22
申请号 US200511080375 申请日期 2005.03.14
申请人 QUALCOMM Incorporated 发明人 Yurochko Michael;Zarnowitz Arthur;Skillman Peter
分类号 G06F3/02;H01H13/83;H01H13/85;H04M1/22 主分类号 G06F3/02
代理机构 Mahamedi Paradice LLP 代理人 Mahamedi Paradice LLP
主权项 1. A modular stack assembly for use as at least a part of a keypad for a mobile computing device, the stack assembly comprising: an electrical contact layer on which a plurality of contact elements are provided; an actuation member layer on which a plurality of actuation members are provided, wherein each actuation member in the plurality of actuation members extends inward from a corresponding key structure of a key structure layer and is aligned so that an axial movement of that actuation member causes a corresponding one of the plurality of contact elements to actuate; and an illumination layer configured to emit light to the keypad, the illumination layer comprising a plurality of discrete light sources that are positioned underneath the actuation member layer and the key structure layer; wherein the electrical contact layer, the actuation member layer and the illumination layer are integrally combined to form at least a portion of the modular stack assembly; wherein the modular stack assembly is structured to be capable of being combined, as a single unit, with a housing of the mobile computing device during an assembly process for manufacturing the mobile computing device.
地址 San Diego CA US