Molded power supply system having a thermally insulated component

摘要

A molded system (100) has a plurality of components (110, 120, 130) attached to a carrier (101), one of the components being an object (110) of irregular thermal capacitance. For example, carrier (101) may be a QFN/SON-type leadframe and object (110) an inductor of high thermal capacitance. The surface of the object is sealed with a hardened polymeric layer (220) of high thermal resistance, whereby the layer (220) thermally insulates the object (110) and inhibits the transport of thermal energy between the object and the system. System (100) has molding compound (140) encapsulating the carrier and the attached components including the object (110) and the polymeric layer sealing the object's surface.

主权项

1. Method for molding a system including an object having irregular thermal capacitance, comprising:
depositing the polymer on the surface of the object while it is a low-viscosity resin so that surface tension pulls the deposited resin into a layer covering the surface uniformly; sealing the surface of the object having irregular thermal capacitance with a polymeric layer having high thermal resistance, thus thermally insulating the object; and then molding over the sealed surface to encapsulate the object and the system in a molding compound.