发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>The purpose of the present invention is to provide a photosensitive resin composition which does not damage basic characteristics such as adhesiveness to a circuit pattern or electric insulation and prevents deterioration of a line shape even if the exposure quantity by a direct drawing device is the same level as the exposure quantity of one shot exposure. The present invention provides the photosensitive resin composition including: (A) a photosensitive resin containing a carboxyl group, (B) a photopolymerization initiator, (C) an epoxy compound, and (D) a colorant, wherein (B) the photopolymerization initiator is an oxime ester compound having two or more carbazole frames in one molecule.</p>
申请公布号 KR20150106837(A) 申请公布日期 2015.09.22
申请号 KR20150032277 申请日期 2015.03.09
申请人 TAMURA CORPORATION 发明人 OKAMOTO YOSHIO;TAKEBAYASHI YOSHIKI;KAKIUCHI NAOYA
分类号 G03F7/028;G03F7/004 主分类号 G03F7/028
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