| 发明名称 | Integrated circuit packaging system with plated leads and method of manufacture thereof | ||
| 摘要 | An integrated circuit packaging system and method of manufacture thereof includes: an L-plated lead; a die conductively connected to the L-plated lead; and an encapsulant encapsulating the L-plated lead and the die. | ||
| 申请公布号 | US9142531(B1) | 申请公布日期 | 2015.09.22 |
| 申请号 | US201414219463 | 申请日期 | 2014.03.19 |
| 申请人 | STATS ChipPAC Ltd. | 发明人 | Camacho Zigmund Ramirez;Bathan Henry Descalzo;Tay Lionel Chien Hui |
| 分类号 | H01L21/44;H01L23/00;H01L21/56 | 主分类号 | H01L21/44 |
| 代理机构 | Ishimaru & Associates LLP | 代理人 | Ishimaru & Associates LLP |
| 主权项 | 1. A method of manufacture of an integrated circuit packaging system comprising: providing a sacrificial support having a cavity provided therein; plating an L-plated lead in the cavity; bonding a die in the cavity conductively connected to the L-plated lead; encapsulating the L-plated lead and the die; attaching a carrier support to the sacrificial support; removing the sacrificial support; and singulating the carrier support into an individual integrated circuit packaging system. | ||
| 地址 | Singapore SG | ||