| 摘要 |
<p>The present invention relates to an apparatus for arranging a solder ball between terminals of an electric part to electrically connect the terminals. The apparatus for arranging a solder ball comprises a solder ball storage unit, a solder ball loading unit, a guide member, a solder ball adsorbing unit, a first drive unit, and a second drive unit. The solder ball storage unit stores a plurality of solder balls, and comprises a solder ball discharge hole for discharging the stored solder balls to the outside. The solder ball loading unit receives the solder balls to load the solder balls thereon. The guide member guide the solder balls to supply the solder balls stored in the solder ball storage unit to the solder ball loading unit. The solder ball adsorbing unit adsorbs the solder balls loaded on the solder ball loading unit. The first drive unit vertically moves the solder ball adsorbing unit between an adsorption location where the solder ball adsorbing unit adsorbs the solder balls loaded on the solder ball loading unit and an arrangement location where the solder ball adsorbing unit arranges the adsorbed solder balls on a terminal. The second drive unit moves the solder ball loading unit back and forth in a direction crossing a vertical moving direction of the solder ball adsorbing unit to position the solder ball loading unit in a gap between the solder ball adsorbing unit and the terminal, or position the solder ball loading unit out of the gap between the solder ball adsorbing unit and the terminal. And, the solder ball adsorbing unit is lowered to the adsorption location to adsorb the solder balls while the solder ball loading unit is positioned in the gap between the solder ball adsorbing unit and the terminal, and the solder ball adsorbing unit is lowered to the arangement location to arrange the solder balls on the terminal while the solder ball loading unit is positioned out of the gap between the solder ball adsorbing unit and the terminal.</p> |
