发明名称 |
MOULD, CARRIER WITH ENCAPSULATED ELECTRONIC COMPONENTS, SEPARATED ENCAPSULATED ELECTRONIC COMPONENT AND METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS |
摘要 |
The invention relates to a mould for encapsulating electronic components mounted on a carrier, with at least two mould parts which are displaceable relative to each other for engaging with a mould cavity round electronic components, and at least one feed for encapsulating material recessed into the mould parts and connecting to the mould cavity. The invention also relates to a carrier with encapsulated electronic components. The invention further relates to a method for encapsulating electronic components and to the thus manufactured encapsulated separated components. The carrier is provided with a plurality of recessed through-openings located at a distance from the electronic components and an encapsulation arranged round the electronic components, wherein through-openings are recessed into the encapsulating material and wherein some of the through-openings recessed into the carrier coincide at least partially with the through-openings recessed into the encapsulating material. |
申请公布号 |
PH12015501563(A1) |
申请公布日期 |
2015.09.21 |
申请号 |
PH12015501563 |
申请日期 |
2015.07.14 |
申请人 |
BESI NETHERLANDS B.V. |
发明人 |
TEUNISSEN, MICHEL HENDRIKUS LAMBERTUS |
分类号 |
B29C45/14;B29C45/37;H01L21/56;H01L23/00 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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