| 摘要 |
According to the present invention, a sputter comprises: a chamber having an internal space to perform a substrate sputtering process; a target installed inside the chamber while the front surface faces substrates to supply materials to be deposited to the substrates; and a backing plate installed on the rear surface of the target and having a cooling water passage in which a refrigerant circulates. A plurality of grooves extended in a crossing direction to the flowing direction of cooling water are formed on at least a part of the inner wall of the cooling water passage and are separated from each other at a predetermined interval in the flowing direction of the cooling water. According to embodiments of the present invention, the introduced cooling water flows in the extended direction of a main passage of the cooling water passage. At this time, the cooling water does not straightly flow, but vertically or spirally flows by the grooves positioned in the lower part of the main passage. Thus, a flowing path of the cooling water is extended longer than only with the main passage and the contact surface area between the cooling water and the inner wall of the main body is expanded. |
