| 摘要 |
A thermally-conductive, electrically-conductive adhesive composition including an electrically-conductive filler (A), an epoxy resin (B), and a curing agent (C). The electrically-conductive filler (A) is submicron silver microparticles and the amount of silver microparticles blended therein is 75 pcnt -94 pcnt by mass of the total amount of thermally-conductive, electrically-conductive adhesive composition. The amount of epoxy resin (B) blended therein is 5 pcnt -20 pcnt by mass of the total amount of thermally-conductive, electrically-conductive adhesive composition. The curing agent (C) is a compound indicated by general formula (I), (II), or (III) and the amount of said compound blended therein is 0.4-2.4 molar equivalent as the active hydrogen equivalent weight, per epoxy group molar equivalent for the epoxy resin (B). Before sintering of the electrically-conductive filler (A) is commenced during thermal hardening, the thermally-conductive, electrically-conductive adhesive composition is in an uncured or semi-cured state. (In formula (I), X indicates -SO2-, -CH2-, or -O- and R1-R4 each independently indicate a hydrogen atom or a lower alkyl group. In formula (II), X indicates -SO2-, -CH2-, or -O- and R5-R8 each independently indicate a hydrogen atom or a lower alkyl group. In formula (III), X indicates -SO2-, -CH2-, or -O-, and R9-R12 each independently indicate a hydrogen atom or a lower alkyl group.) |
