| 摘要 |
The present invention relates to a silver(Ag)alloy bonding wire, and more particularly, to a silver alloy bonding wire with silver as the main ingredient, which includes 0.5 to 4 pcnt by weight of palladium (Pd) and 2 to 8 pcnt by weight of gold (Au), characterized in that, when the bonding wire is cut perpendicularly to the direction of the length, the ratio (a/b) of the average particle size (a) of the outer part of the cross section to that (b) of the central part thereof is 0.3 to 3. The bonding wire according to the present invention has the properties of high resistance to a thermal impulse, excellent SOB bonding, and excellent bonding in an atmosphere of nitrogen. |
