SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

Provided is a semiconductor device having a strong bond with a substrate. An outer lead (5) interposes an inner lead for electrically connecting to an inner lead hanging lead (3), and thereby a plating film is formed at a cutting surface of the outer lead (11). And a solder layer is easily formed at a whole surface of the outer lead extended from a sealing resin (10).