| 摘要 |
The present invention relates to the development of a material to be used in the printed circuit board (PCB). More specifically, the present invention relates to a solder mask ink capable of preventing the electrical connection failure (or short-circuit) when a surface mount technology (SMT) is applied on the surface of a final layer and a method for manufacturing a PCB by using the ink. The ink includes: 33.2% of a binder polymer; 14.4% of an epoxy resin; 4.8% of photo-initiators; and 0.8% of a thermal curing agent. The present invention relates to the development of the solder mask ink capable of enabling an exposure process to be executed at low light while maintaining the reliability and quality of the existing process. The present invention can also reduce the operation lead time of a facility at low light to increase the productivity. |
