发明名称 CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 <p>The present invention relates to a chip electronic component and a manufacturing method thereof and, more specifically, to a chip electronic component which can prevent a short circuit between coils and realize an internal coil structure having a high aspect ratio (AR) by increasing a height-to-width ratio of the coil, and to a manufacturing method thereof.</p>
申请公布号 KR20150105787(A) 申请公布日期 2015.09.18
申请号 KR20140027766 申请日期 2014.03.10
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, GO EUN;HWANG, HWA SUNG;MAKOTO DOBASHI
分类号 H01F17/00;H01F41/04 主分类号 H01F17/00
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