发明名称 |
CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>The present invention relates to a chip electronic component and a manufacturing method thereof and, more specifically, to a chip electronic component which can prevent a short circuit between coils and realize an internal coil structure having a high aspect ratio (AR) by increasing a height-to-width ratio of the coil, and to a manufacturing method thereof.</p> |
申请公布号 |
KR20150105787(A) |
申请公布日期 |
2015.09.18 |
申请号 |
KR20140027766 |
申请日期 |
2014.03.10 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, GO EUN;HWANG, HWA SUNG;MAKOTO DOBASHI |
分类号 |
H01F17/00;H01F41/04 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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