PCB BACK DRILL DETECTION METHOD AND PCB PLATING

摘要

A method for detecting back-drilled holes in a PCB and a PCB panel are provided. The method comprises: forming, on a metal layer of a first inner layer of a multi-layer PCB, metal rings according to positions of the back-drilled holes during a process of forming the PCB, wherein each of the formed metal rings has an outer diameter greater than an aperture of each of the back-drilled holes; forming, at positions corresponding to the positions of the back-drilled holes, metal holes extending through an outer layer of the PCB and the formed metal rings; forming two first detection holes electrically connected with the formed metal rings; forming the back-drilling holes on the PCB, which extend through and expand the metal holes; and detecting an electrical conduction between the two first detection holes so as to determine whether a position offset exists between the back-drilled holes and the metal holes.

主权项

1. A method for detecting a back-drilled hole in a PCB, comprising:
forming, on a metal layer of a first inner layer of a multi-layer PCB, a metal ring according to a position of a back-drilled hole to be formed during a process of forming the PCB, wherein the formed metal ring has an outer diameter greater than an aperture of the back-drilled hole to be formed; forming, at position corresponding to the position of the back-drilled hole to be formed, a metal hole extending through an outer layer of the PCB and the formed metal ring; forming two first detection holes electrically connected with the formed metal ring; forming the back-drilling hole on the PCB, which extends into and expand the metal hole; and detecting an electrical conduction between the two first detection holes so as to determine whether a position offset exists between the back-drilled hole and the metal hole.