| 发明名称 |
PERFORATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION |
| 摘要 |
An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate. |
| 申请公布号 |
US2015262941(A1) |
申请公布日期 |
2015.09.17 |
| 申请号 |
US201514640237 |
申请日期 |
2015.03.06 |
| 申请人 |
STMicroelectronics (Grenoble 2) SAS ;STMicroelectronics (Rousset) SAS |
发明人 |
Steffen Francis;Mathey Delphine;Assaud Gilbert;Brechignac Rémi |
| 分类号 |
H01L23/00;H01L21/311;H01L23/522;H01L23/31;H01L23/04 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic package, comprising:
a means of support; at least one integrated circuit chip supported by said means of support; electrical connection means configured to electrically connect to the integrated circuit chip; and at least one weakening deep perforation formed in the means of support, said weakening deep perforation configured to reduce a resistance of the electronic package to bending stresses perpendicular to the means of support. |
| 地址 |
Grenoble FR |
