| 发明名称 |
CURABLE RESIN COMPOSITION, PRODUCTION METHOD OF IMAGE SENSOR CHIP USING THE SAME, AND IMAGE SENSOR CHIP |
| 摘要 |
There is provided a curable resin composition which is capable of being coated so as to have a film thickness of 20 μm or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, and the infrared ray cut filter having a dye-containing layer having a film thickness of 20 μm or more formed from the curable resin composition, and a production method of image sensor chip comprising a step of coating the curable resin composition on a glass substrate to form a dye-containing layer, and a step of adhering the glass plate having the dye-containing layer formed on a solid-state imaging device substrate. |
| 申请公布号 |
US2015259547(A1) |
申请公布日期 |
2015.09.17 |
| 申请号 |
US201514725823 |
申请日期 |
2015.05.29 |
| 申请人 |
FUJIFILM Corporation |
发明人 |
EZOE Toshihide;NARA Yuki;SHIMADA Kazuto |
| 分类号 |
C09D7/00;C09D5/00;H01L27/146;G02B5/22;G02B1/11 |
主分类号 |
C09D7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A curable resin composition which is capable of being coated so as to have a film thickness of 20 μm or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm. |
| 地址 |
Tokyo JP |
