| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal compression bonding system for bonding a semiconductor element.SOLUTION: A thermal compression bonding system 200 includes: a bond head assembly 220 including a heating device 224 which heats a semiconductor element to be bonded and a fluid passage which is formed so as to receive a cooling fluid; a compression cooling fluid source 202; a pressure increase pump 204 which receives a compression cooling fluid from the compression cooling fluid source and increases a pressure of the received compression cooling fluid; a compression fluid reservoir 206 which receives the compression cooling fluid from the pressure increase pump 204; and a flow control valve 208 which controls the supply of the compression cooling fluid flowing from the compression fluid reservoir to the fluid passage. |
