发明名称 CIRCUIT BOARDS, CONNECTORS, CASES, CIRCUIT BOARD ASSEMBLIES, CASE ASSEMBLIES, DEVICES AND METHODS OF MANUFACTURING THE SAME
摘要 Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.
申请公布号 US2015264820(A1) 申请公布日期 2015.09.17
申请号 US201514721973 申请日期 2015.05.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BANG Hyojae;KIM Dogeun;KIM Hongkyun;JEON Youngbok
分类号 H05K5/00;H05K1/18;G06F1/18 主分类号 H05K5/00
代理机构 代理人
主权项 1. (canceled)
地址 Suwon-si KR