| 发明名称 |
BACKLIGHT UNIT AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A manufacturing method of a backlight unit includes providing a solder paste on a printed circuit board and forming a solder part in a first area of the printed circuit board, aligning a bank mask on the printed circuit board to align a first opening defined through the bank mask with a second area of the printed circuit board not overlapped with the first area, providing a bank material in the first opening and forming a bank on the printed circuit board in an area corresponding to the second area, separating the bank mask from the printed circuit board including the bank thereon, and connecting the solder part of the printed circuit board and a light emitting unit to each other. |
| 申请公布号 |
US2015261040(A1) |
申请公布日期 |
2015.09.17 |
| 申请号 |
US201514599630 |
申请日期 |
2015.01.19 |
| 申请人 |
Samsung Display Co., Ltd. |
发明人 |
KIM Hyun-Jeong;KIM HYUK-HWAN;NAM SEOKHYUN;SONG Si joon |
| 分类号 |
G02F1/1335;B05D1/36;B05D1/32;B23K1/00;B23K31/02 |
主分类号 |
G02F1/1335 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a backlight unit, comprising:
providing a solder paste on a printed circuit board, and forming a solder part in a first area of the printed circuit board; aligning a bank mask on the printed circuit board including the solder part thereon, to align a first opening defined through the bank mask with a second area of the printed circuit board not overlapped with the first area; providing a bank material in the aligned first opening to form a bank on the printed circuit board in an area corresponding to the second area; separating the bank mask from the printed circuit board including the bank thereon; and connecting the solder part of the printed circuit board and a light emitting unit to each other. |
| 地址 |
Yongin-City KR |
