| 摘要 |
A package (10) for storing an electronic component is provided with: a base plate (11) having on an upper surface thereof a mounting region (R) on which electronic components (20) are mounted; a frame (12) having a through-hole part (H), the frame (12) being provided on an upper surface of the base plate (11) so as to encircle the mounting region (R); and input/output members (13) in which a plurality of wiring conductors (131) electrically coupled to the electronic components (20) extend into and out of the frame (12) and extend along the lower surface on the outside of the frame (12), the input/output members (13) being provided so as to close the through-hole part (H) of the frame (12), and the input/output members (13) having notched parts (C) which are cut out on the lower surface along a wiring conductor (131) among the plurality of wiring conductors (131) so as to cross the outer side surface of the input/output members (13). Consequently, a package (10) for storing an electronic component can be provided that is compact and has excellent high-frequency properties. |
