PRINTED CIRCUIT BOARD ASSEMBLIES PROVIDING FAULT DETECTION

摘要

Printed circuit board assemblies providing fault detection are provided. One example printed circuit board assembly includes a substrate layer. One or more solder pins are located on a rear surface of the substrate layer. The printed circuit board assembly includes a non-conductive layer adjacent to the rear surface of the substrate layer. The printed circuit board assembly includes a conductive layer adjacent to the non-conductive layer. The conductive layer is electrically connected to a ground. The printed circuit board assembly includes a mounting surface. The printed circuit board assembly includes a support layer compressed between the conductive layer and the mounting surface. The support layer applies a mechanical force that presses the conductive layer towards the non-conductive layer.

主权项

1. A printed circuit board assembly comprising:
a substrate layer, wherein one or more solder pins are located on a rear surface of the substrate layer; a non-conductive layer adjacent to the rear surface of the substrate layer; a conductive layer adjacent to the non-conductive layer, wherein the conductive layer is electrically connected to a ground; a mounting surface; and a support layer compressed between the conductive layer and the mounting surface, wherein the support layer applies a mechanical force that presses the conductive layer towards the non-conductive layer.