发明名称 SEMICONDUCTOR DEVICE
摘要 According to one embodiment, a semiconductor device includes a first electrode, a second electrode, a first semiconductor region, a second semiconductor region, an insulating region, and a third semiconductor region. The first semiconductor region is of a first conductivity type. The first semiconductor region is provided between the first electrode and the second electrode, and contacts the first electrode. The second semiconductor region is of a second conductivity type. The second conductor region is provided between the first semiconductor region and the second electrode. The insulating region extends from the second electrode to a side of the first semiconductor region. The third semiconductor region is of the first conductivity type. The third semiconductor region is provided in at least a portion of a region between the second semiconductor region and the insulating region, and contacts the first semiconductor region.
申请公布号 US2015263149(A1) 申请公布日期 2015.09.17
申请号 US201414485028 申请日期 2014.09.12
申请人 Kabushiki Kaisha Toshiba 发明人 Ogura Tsuneo;Misu Shinichiro;Matsudai Tomoko;Yasuhara Norio
分类号 H01L29/739 主分类号 H01L29/739
代理机构 代理人
主权项 1. A semiconductor device, comprising: a first electrode; a second electrode; a first semiconductor region of a first conductivity type provided between the first electrode and the second electrode, the first semiconductor region contacting the first electrode; a second semiconductor region of a second conductivity type provided between the first semiconductor region and the second electrode; an insulating region extending from the second electrode to a side of the first semiconductor region; and a third semiconductor region of the first conductivity type provided in at least a portion of a region between the second semiconductor region and the insulating region, the third semiconductor region contacting the first semiconductor region.
地址 Tokyo JP