Embodiments are disclosed that relate to implementing semiconductor device cooling systems that leverage awareness of regional voltage and temperature reliability risk considerations. For example, one disclosed embodiment provides a method of implementing a cooling system configured to cool an integrated circuit. The method involves first determining a heat dissipation factor that would reduce each region of the integrated circuit to a reduced temperature in order to maintain an overall failure rate. An analysis is then performed, using an insight about the relative reliability risk of elevated voltage and temperatures, to identify a region of the integrated circuit whose temperature can be permitted to rise without exceeding the overall failure rate, thereby permitting implementation of a cooling system with a reduced heat dissipation factor.
申请公布号
WO2015138527(A2)
申请公布日期
2015.09.17
申请号
WO2015US19812
申请日期
2015.03.11
申请人
MICROSOFT TECHNOLOGY LICENSING, LLC
发明人
MAITRA, KINGSUK;NGUYEN, TUNG THANH;LANGENDORF, BRIAN KEITH;PURTELL, JULIA;JENSEN, RUNE HARTUNG;GANNAMANI, RANJIT;MARATHE, AMIT PRABHAKAR