| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a release film (carrier film) with which a high-quality ceramic green sheet having no presence of thin portions or through-holes can be manufactured without using a special substrate film (e.g. a PET film) having decreased amounts of filler or foreign substances, and a method for manufacturing a multilayer ceramic electronic component with high reliability by using the above film.SOLUTION: The release film includes a substrate film having a plurality of projections on a surface thereof, and a release layer covering the surface. A thickness T1 of the release layer, which is a dimension from the surface of the release layer to the bottom of the projection of the substrate film, is controlled to be larger than a height H of the projection, which is a dimension along a direction X from the top of the projection of the substrate film to the bottom of the projection. Otherwise, the release film includes a substrate film having a plurality of recesses on a surface thereof, and a release layer covering the surface. A thickness T2 of the release layer, which is a dimension from the surface of the release layer to the bottom of the recess of the substrate film, is controlled to be larger than a depth D of the recess.</p> |
