Semiconductor Device Including Stacked Semiconductor Chips

摘要

A semiconductor device comprising a plurality of semiconductor chips and a plurality of through-line groups is disclosed. Each of the through-line groups consists of a unique number of through-lines. The numbers associated with the through-line groups are mutually coprime to each other. When one of the through-lines is selected for the each through-line group, one of the semiconductor chip is designated by a combination of the selected through-lines of the plurality of the through-line groups.

主权项

1. A method for selecting a semiconductor chip in a stack of semiconductor chips interconnected by through lines comprising:
receiving a plurality of selection signals at first terminals located on a first surface of the semiconductor chip; connecting each of the first terminals to a selected one of a plurality of second terminals located on a second surface of the semiconductor chip and aligned with the plurality of first terminals, wherein said second terminals are not aligned with the first terminals to which they are connected; and generating an internal signal based on a predetermined one of the plurality of selection signals.