| 发明名称 |
PROBE TIP STRUCTURE FOR BONDINGLESS ELECTRONIC LAPPING GUIDE CONNECTIONS |
| 摘要 |
A lapping system including a substrate having an air bearing surface and at least one slider, wherein each slider comprises at least one electronic lapping guide pad, and a probe card comprising at least one extending probe comprising a body member and a distal end, the probe card being movable in a direction of compression between a first position in which the distal end of a first extending probe is spaced from a top surface of one of a first electronic lapping guide pad and a second position in which the distal end of the first extending probe contacts the top surface the first electronic lapping guide pad, wherein the first extending probe is pre-loaded with a predetermined spring force in the direction of compression. |
| 申请公布号 |
US2015260757(A1) |
申请公布日期 |
2015.09.17 |
| 申请号 |
US201414216186 |
申请日期 |
2014.03.17 |
| 申请人 |
Seagate Technology LLC |
发明人 |
Li Leping;Maytag Kara L.;Keo Saravuth |
| 分类号 |
G01R1/073;G11B5/31;G01B7/06 |
主分类号 |
G01R1/073 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A lapping system comprising:
a substrate comprising a front surface and at least one slider, wherein each slider comprises at least one electronic lapping guide pad; and a probe card comprising at least one extending probe comprising a body member and a distal end, the probe card being movable in a direction of compression between a first position in which the distal end of a first extending probe is spaced from a top surface of one of a first electronic lapping guide pad and a second position in which the distal end of the first extending probe contacts the top surface the first electronic lapping guide pad, wherein the first extending probe is pre-loaded with a predetermined spring force in the direction of compression. |
| 地址 |
Cupertino CA US |
