发明名称 SELF-FORMATION OF HIGH-DENSITY ARRAYS OF NANOSTRUCTURES
摘要 A method for forming nanostructures includes bonding a flexible substrate to a crystalline semiconductor layer having a two-dimensional material formed on a side opposite the flexible substrate. The crystalline semiconductor layer is stressed in a first direction to initiate first cracks in the crystalline semiconductor layer. The first cracks are propagated through the crystalline semiconductor layer and through the two-dimensional material. The stress of the crystalline semiconductor layer is released to provide parallel structures including the two-dimensional material on the crystalline semiconductor layer.
申请公布号 US2015263087(A1) 申请公布日期 2015.09.17
申请号 US201514726104 申请日期 2015.05.29
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DIMITRAKOPOULOS CHRISTOS D.;KIM JEEHWAN;PARK HONGSIK;SHIN BYUNGHA
分类号 H01L29/06;H01L29/16 主分类号 H01L29/06
代理机构 代理人
主权项 1. A semiconductor device, comprising: a flexible substrate; a crystalline semiconductor layer bonded to the flexible substrate, the crystalline semiconductor layer being cracked to form parallel structures along at least one direction; and a two-dimensional material formed on the crystalline semiconductor layer being separated at cracks in the crystalline semiconductor layer to form nanostructures.
地址 Armonk NY US
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