METHOD OF GENERATING A SET OF DEFECT CANDIDATES FOR WAFER

摘要

A method of generating a set of defect candidates for a wafer is disclosed. The wafer comprises at least one die manufactured according to a mask, and the mask being prepared by combining a plurality of layout areas. The method includes receiving an initial defect information from a wafer scanning device indicating potential defects of a semiconductor wafer and determining a boundary region on the semiconductor wafer. The method further includes creating an exclusion region from the boundary region, the exclusion region having a first set of defects in the potential defects of the semiconductor wafer, and creating filtered defect information by removing the first set of defects from the initial defect information.

主权项

1. A method of generating a set of defect candidates for a wafer, the wafer comprising at least one die manufactured according to a mask, the mask being prepared by combining a plurality of layout areas, the method comprising:
receiving an initial defect information from a wafer scanning device indicating potential defects of a semiconductor wafer; determining a boundary region on the semiconductor wafer; creating an exclusion region from the boundary region, the exclusion region having a first set of defects in the potential defects of the semiconductor wafer; and creating filtered defect information by removing the first set of defects from the initial defect information.