发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor device comprises a plurality of semiconductor chips stacked on a substrate. The semiconductor chip comprises: an internal power supply voltage generating circuit that generates an internal power supply voltage based on an external power supply; a power supply line that supplies the internal power supply voltage; an internal power supply pad connected to the power supply line; and a stabilizing capacitance connected to the power supply line. The internal power supply pad is electrically short-circuited with the internal power supply pad included in another semiconductor chip.
申请公布号 US2015261245(A1) 申请公布日期 2015.09.17
申请号 US201414299071 申请日期 2014.06.09
申请人 Kabushiki Kaisha Toshiba 发明人 INOUE Satoshi;SHIMIZU Yuui
分类号 G05F3/02 主分类号 G05F3/02
代理机构 代理人
主权项 1. A semiconductor device, comprising a plurality of semiconductor chips disposed on a substrate, the semiconductor chip comprising: an internal power supply voltage generating circuit that generates an internal power supply voltage based on an external power supply; a power supply line that supplies the internal power supply voltage; an internal power supply pad connected to the power supply line; and a stabilizing capacitance connected to the power supply line, and the internal power supply pad being electrically short-circuited with the internal power supply pad included in another semiconductor chip.
地址 Minato-ku JP