| 摘要 |
An electrolytic copper plating solution analysis device is provided with: a container for analysis that accommodates, as a sample for analysis, a portion of an electrolytic copper plating solution including an additive including an accelerator, inhibitor, and leveler; a working electrode that is immersed in the electrolytic copper plating solution accommodated in the container for analysis and transfers electrons; a reference electrode that is immersed in the electrolytic copper plating solution and is used as a reference at the time of the determination of the electric potential of the working electrode; a counter electrode immersed in the electrolytic copper plating solution; a rotary drive unit for rotating the working electrode at a constant speed; a current generation unit for causing current having a constant current density to flow between the working electrode and the counter electrode; an electric potential measurement unit for measuring the electric potential between the working electrode and the reference electrode; and an analysis unit for analyzing the relationship between the amount of time that has passed since current was made to flow and the electric potential. |
