| 摘要 |
An electronic component is connected at a low temperature and connection failure of the electronic component is improved by using a photocurable adhesive. An anisotropic conductive adhesive which comprises a binder resin layer supported by a releasing base, and wherein the binder resin layer contains a photopolymerizable compound, a photopolymerization initiator, a light absorbent, and conductive particles. The light absorption peak wavelength of the light absorbent is larger than the light absorption peak wavelength of the photopolymerization initiator by 20 nm or more. |
