发明名称 |
ELECTRONIC COMPONENT |
摘要 |
A multilayer ceramic capacitor includes flat inner electrodes that are laminated on each other. An interposer includes a substrate that is larger than the multilayer ceramic capacitor. A first mounting electrode to mount the multilayer ceramic capacitor is located on a first principal surface of the substrate, and a first external connection electrode for connection to an external circuit board is located on a second principal surface. A recess is located in a side surface of the interposer. A connecting conductor is located in the wall surface of the recess. The connecting conductor is located at a position spaced apart by a predetermined distance from the side surface of the interposer. |
申请公布号 |
US2015262753(A1) |
申请公布日期 |
2015.09.17 |
申请号 |
US201514726785 |
申请日期 |
2015.06.01 |
申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
HATTORI Kazuo;FUJIMOTO Isamu |
分类号 |
H01G2/06;H05K1/18;H01G4/12 |
主分类号 |
H01G2/06 |
代理机构 |
|
代理人 |
|
主权项 |
1. (canceled) |
地址 |
Nagaokakyo-shi JP |