| 发明名称 |
COMPOSITION FOR ENCAPSULANT AND ENCAPSULANT AND ELECTRONIC DEVICE |
| 摘要 |
Provided are a composition for an encapsulant having a viscosity of about 4,000 to about 9,500 mPa·s when measured using a Brookfield (DV-II+pro) spindle No. 52 at a torque of about 90% under atmospheric pressure at about 23° C., whereby maintaining a phosphor precipitation degree within about 18% when including a phosphor and allowed to stand at about 23° C. for greater than or equal to about 2 hours, and including at least one first siloxane compound having a silicon-bonded hydrogen (Si—H) and at least one second siloxane compound having a silicon-bonded alkenyl group (Si-Vi), an encapsulant obtained by curing the composition, and an electronic device including the encapsulant. |
| 申请公布号 |
US2015263249(A1) |
申请公布日期 |
2015.09.17 |
| 申请号 |
US201514643620 |
申请日期 |
2015.03.10 |
| 申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
YOO Hong-Jung;KIM Young-Ho;KIM Woo-Han;SONG Doo-Ri;LEE Eun-Seon |
| 分类号 |
H01L33/56;C09D183/06 |
主分类号 |
H01L33/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A composition for an encapsulant, the composition comprising:
a first siloxane compound having a silicon-bonded hydrogen; and a second siloxane compound having a silicon-bonded alkenyl group, wherein: the composition has a viscosity of about 4,000 to about 9,500 mPa·s when measured using a Brookfield (DV-II+pro) spindle No. 52 at a torque of about 90% under atmospheric pressure at about 23° C., and the composition, when combined with a predetermined phosphor and allowed to stand at about 23° C. for greater than or equal to about 2 hours, exhibits a phosphor precipitation degree of about 18% or less. |
| 地址 |
Yongin-si KR |
