发明名称 Light Emitting Device
摘要 A light emitting device includes: a substrate; an electrode pattern formed on the substrate; a light emitting element connected to the electrode pattern; a ridge-shaped resin covering portion which covers a part of the electrode pattern, and which includes a first and second outer edge portions; first and second through holes formed to penetrate through the electrode pattern such that the substrate is exposed; and first and second hole arrays including the first and second through holes arranged along the first and second outer edge portions, respectively. The first and second outer edge portions cover at least a part of the first and second through holes, respectively, and are bonded to the substrate in the first and second through holes, respectively.
申请公布号 US2015263247(A1) 申请公布日期 2015.09.17
申请号 US201514625384 申请日期 2015.02.18
申请人 TOYODA GOSEI CO., LTD. 发明人 WADA Satoshi;FUKUI Kosei
分类号 H01L33/54;H01L33/46;H01L33/38 主分类号 H01L33/54
代理机构 代理人
主权项 1. A light emitting device comprising: a substrate; an electrode pattern formed on the substrate; a light emitting element connected to the electrode pattern; a ridge-shaped resin covering portion which covers a part of the electrode pattern, and which comprises a first outer edge portion and a second outer edge portion; a plurality of first through holes and a plurality of second through holes, which are formed to penetrate through the electrode pattern such that the substrate is exposed from bottoms of the first though holes and the second though holes; a first hole array comprising the first through holes arranged along the first outer edge portion; and a second hole array comprising the second through holes arranged along the second outer edge portion, wherein the first outer edge portion covers at least a part of each of the first through holes constituting the first hole array, and is bonded to the substrate in an inside of the first through holes, and wherein the second outer edge portion covers at least a part of each of the second through holes constituting the second hole array, and is bonded to the substrate in an inside of the second through holes.
地址 Kiyosu-shi JP