| 摘要 |
A photosensor simplifies the resin molding process for an emitter element, a receiver element, and a luminous element forming an operation indicator lamp. The photosensor includes an emitter element, an emitter-encapsulating portion, a receiver element, a receiver-encapsulating portion, a circuit portion, and a circuit-encapsulating portion. The emitter-encapsulating portion encapsulates the emitter element. The receiver-encapsulating portion encapsulates the receiver element. The circuit portion includes a luminous element for indicating an operation. The circuit-encapsulating portion encapsulates the circuit portion. The circuit-encapsulating portion includes an operation indicator portion facing the luminous element. The emitter-encapsulating portion, the receiver-encapsulating portion, and the circuit-encapsulating portion are connected to one another with a conductive leadframe. The emitter-encapsulating portion, the receiver-encapsulating portion, and the circuit-encapsulating portion are formed from the same resin material containing a light diffusing agent. |
| 主权项 |
1. A photosensor, comprising:
an emitter element; an emitter-encapsulating portion encapsulating the emitter element; a receiver element; a receiver-encapsulating portion encapsulating the receiver element; a circuit portion including a luminous element for indicating an operation; and a circuit-encapsulating portion encapsulating the circuit portion and including an operation indicator portion facing the luminous element, wherein the emitter-encapsulating portion, the receiver-encapsulating portion, and the circuit-encapsulating portion are connected to one another with a conductive leadframe, and are formed from the same resin material containing a light diffusing agent. |
