SKIN MATERIAL DESIGN TO REDUCE TOUCH TEMPERATURE

摘要

An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (ρ) and density (Cp) for the material, such that k*ρ*Cp is between 0 (J*W)/(m4*K2) and 1,000,000 (J*W)/(m4*K2). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m3, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m3, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m3, and a specific heat between 1900-2000 J/kg-K.

主权项

1. An electronic device, comprising:
a housing having a plurality of sides, each side having an interior surface and an exterior surface; electronic components contained within the housing; and a porous and thermally conductive material associated with at least one of the plurality of sides of the housing, the material having a thermal conductively (k) and a porosity of between 10% and 70%, wherein the porosity results in a specific heat (ρ) and density (Cp) for the porous and thermally conductive material, such that a product k*ρ*Cp is between 0 (J*W)/(m4*K2) and 1,000,000 (J*W)/(m4*K2).