发明名称 |
ELECTRIC COMPONENT ASSEMBLY |
摘要 |
The invention relates to an electric component assembly (1) comprising at least one first discrete semi-conductor component (2) which comprises a first housing (3) with a first housing outer surface (4), said first housing outer surface (4) being designed as an electric contact of the first semi-conductor component (2). According to the invention, the first housing outer surface (4) is connected in an electrically conducting manner to an electrically conductive plate (5) of the electric component assembly (1) and that the electrically conductive plate (5) is connected in an electrically insulating manner to a cooling body (6) of the electric component assembly (1). |
申请公布号 |
WO2015135010(A1) |
申请公布日期 |
2015.09.17 |
申请号 |
WO2015AT00037 |
申请日期 |
2015.03.10 |
申请人 |
EGSTON SYSTEM ELECTRONICS EGGENBURG GMBH |
发明人 |
JAMY, ROMAN;PRAND-STRITZKO, ERNST |
分类号 |
H01L23/373;H01L23/473;H01L23/492;H01L23/495;H01L25/07 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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