| 发明名称 |
SYSTEM AND METHOD FOR EXTRACTING ELECTRONIC COMPONENTS |
| 摘要 |
A method for extracting electronic components comprising the steps of heating an electronic device having one or more electronic components by delivering heat energy to the electronic device directly to a first side surface or a second side surface of the electronic device and disturbing the electronic device to separate the one or more electronic components from the electronic device. |
| 申请公布号 |
US2015264847(A1) |
申请公布日期 |
2015.09.17 |
| 申请号 |
US201414418248 |
申请日期 |
2014.01.29 |
| 申请人 |
Li Tong (H.K.) Telecom Company Limited |
发明人 |
Zhang Lei;Wang Ming-Tong |
| 分类号 |
H05K13/04 |
主分类号 |
H05K13/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for extracting electronic components comprising the steps of:
heating an electronic device having one or more electronic components by delivering heat energy to the electronic device directly to a first side surface or a second side surface of the electronic device and; disturbing the electronic device to separate the one or more electronic components from the electronic device. |
| 地址 |
New Territories HK |
