| 发明名称 |
CIRCUIT BOARD AND MANUFACTURING METHOD OF CIRCUIT BOARD |
| 摘要 |
A circuit board includes: a substrate; a through hole formed in the substrate; and a connection terminal provided in the through hole; wherein the connection terminal includes a pedestal portion provided within the through hole and a pin which is provided at a center of the pedestal portion and extends from the pedestal portion toward a first surface of the substrate, so that a first end portion protrudes from the first surface. |
| 申请公布号 |
US2015264810(A1) |
申请公布日期 |
2015.09.17 |
| 申请号 |
US201514636356 |
申请日期 |
2015.03.03 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
BABA Shunji;WATANABE Manabu;FUKUZONO Kenji;OHSAWA Satoshi;YAMADA Tetsuro;WAKABAYASHI Akihiro;MASUDA Yasushi;MIURA Yohei |
| 分类号 |
H05K1/11;H05K3/30;H05K3/10;H05K1/18 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board, comprising:
a substrate; a through hole formed in the substrate; and a connection terminal provided in the through hole; wherein the connection terminal includes a pedestal portion provided within the through hole and a pin which is provided at a center of the pedestal portion and extends from the pedestal portion toward a first surface of the substrate, so that a first end portion protrudes from the first surface. |
| 地址 |
Kawasaki-shi JP |
