FAULT CONTAINMENT ROUTING

摘要

Systems and methods described herein provide for a circuit board having multiple fault containment regions therein. The circuit board includes a first fault containment region defined, at least in part, by first and second metal layers coupled to ground. The first fault containment region includes a first signal layer between the first and second metal layers, a third metal layer between the first and second metal layers, the third metal layer connected to the first signal layer to provide a return path for the first signal layer, and a fourth metal layer between the first and second metal layers, the fourth metal layer connected to the first signal layer to provide power to the first signal layer. The circuit board also includes a second fault containment region in a plurality of layers below the first fault containment region.

主权项

1. A circuit board comprising:
a first fault containment region defined, at least in part, by first and second metal layers coupled to ground; the first fault containment region including:
a first signal layer between the first and second metal layers;a third metal layer between the first and second metal layers, the third metal layer connected to the first signal layer to provide a return path for the first signal layer; anda fourth metal layer between the first and second metal layers, the fourth metal layer connected to the first signal layer to provide power to the first signal layer; and a second fault containment region in a plurality of layers below the first fault containment region, the second fault containment region defined, at least in part, by a fifth metal layer and the second metal layer, the second fault containment region including:
a second signal layer between the second and fifth metal layers;a sixth metal layer between the second and fifth metal layers, the sixth metal layer connected to the second signal layer to provide a return path for the second signal layer; anda seventh metal layer between the second and fifth metal layers, the seventh metal layer connected to the second signal layer to provide power for the second signal layer.