| 主权项 |
1. A semiconductor device comprising:
a substrate having a connection; a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a first loop linking the connection and a first bond formed on the first electrode; and a second loop linking the first bond and a second bond formed on the second electrode, wherein the first loop has a folded-back portion formed by stretching out the first loop from the first bond in a first direction and then folding it back in a second direction different from the first direction, wherein the folded-back portion is in a shape in which it is squashed against the first bond, and wherein the second loop is bonded to the folded-back portion, and an end of the second loop is located at a second position, of the first loop, offset in a direction in which the first loop extends, from a first position that is the center of the first bond. |
