| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A semiconductor device includes a semiconductor chip, a metallic lead frame, a metallic connector, and a sealing portion. The semiconductor chip includes a front surface electrode. The lead frame includes a first portion with a front surface on which the semiconductor chip is mounted, and a second portion which is physically separate from the first portion. The connector includes a first joining portion which is joined to the front surface of the semiconductor chip, a second joining portion which extends perpendicularly with respect to and is joined to a front surface of the second portion, and a connection portion which connects the first joining portion and the second joining portion. The sealing portion covers the semiconductor chip, the front surfaces of the first and second portions, and the metallic connector. |
| 申请公布号 |
US2015262917(A1) |
申请公布日期 |
2015.09.17 |
| 申请号 |
US201414446204 |
申请日期 |
2014.07.29 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
FUKUI Takeshi |
| 分类号 |
H01L23/495;H01L21/56;H01L23/00;H01L23/29;H01L21/48 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor chip that includes a front surface electrode; a metallic lead frame including a first portion with a front surface on which the semiconductor chip is mounted, and a second portion which is physically separate from the first portion; a metallic connector including a first joining portion which is joined to a front surface of the semiconductor chip, a second joining portion which extends perpendicularly with respect to and is joined to a front surface of the second portion, and a connection portion which connects the first joining portion and the second joining portion; and a sealing portion that covers the semiconductor chip, the front surfaces of the first and second portions, and the metallic connector. |
| 地址 |
Tokyo JP |
