发明名称 |
MANUFACTURING METHOD OF THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE |
摘要 |
Provided is a manufacturing method of a three-dimensional structure which manufactures a three-dimensional structure by laminating layers, the method including: forming the layers using a composition A containing three-dimensional formation powders and a solvent; discharging a binding solution for binding the three-dimensional formation powders to the layers; binding the three-dimensional formation powders by curing the discharged binding solution; removing the non-bound three-dimensional formation powders using the solvent; and additionally adding the three-dimensional formation powders to a mixed solution generated by the removing and containing the non-bound three-dimensional formation powders and the solvent, and preparing a composition B containing the three-dimensional formation powders and the solvent. |
申请公布号 |
US2015258705(A1) |
申请公布日期 |
2015.09.17 |
申请号 |
US201514638318 |
申请日期 |
2015.03.04 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HIRATA Koki |
分类号 |
B28B1/00;B28B13/02;B29C67/00;B22F3/00;B22F1/00 |
主分类号 |
B28B1/00 |
代理机构 |
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代理人 |
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主权项 |
1. A manufacturing method of a three-dimensional structure which manufactures a three-dimensional structure by laminating layers, the method comprising:
forming the layers using a composition A containing three-dimensional formation powders and a solvent; discharging a binding solution for binding the three-dimensional formation powders to the layers; binding the three-dimensional formation powders by curing the discharged binding solution; removing the non-bound three-dimensional formation powders using the solvent; and additionally adding the three-dimensional formation powders to a mixed solution generated by the removing and containing the non-bound three-dimensional formation powders and the solvent, and preparing a composition B containing the non-bound three-dimensional formation powders and the solvent. |
地址 |
Tokyo JP |