| 摘要 |
A package includes a first package including a device die, a molding compound molding the device die, a through-via penetrating the molding compound, and a plurality of first redistribution lines (RDLs) and a plurality of second RDLs on the opposite side of the molding compound. The through-via electrically connects one of the first RDLs to one of the second RDLs. The package further includes a second package bonded to the first package, a spacer disposed in a gap between the first package and the second package, and a first electrical connector and a second electrical connector on the opposite side of the spacer. The first electrical connector and the second electrical connector electrically connect the first package to the second package. The spacer is placed apart from the first electrical connector and the second electrical connector. |
