发明名称 電子部品ユニット
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic component unit, capable of efficiently radiating heat generated from an electronic component without affecting the electronic component. <P>SOLUTION: In an electronic component unit 10A in which a pyrogenic electronic component 14 mounted on one surface side of a substrate 12 is housed in a box-shaped case 16, the electronic component 14 is housed in the case 16 in such a manner that the top end face 14a of the electronic component 14 faces the bottom face (bottom face 20a of a partition portion 20) of the case 16 with a predetermined gap t1 between with the bottom face 20a. On the bottom face 20a side of the case 16, there is provided a bottom face side heat dissipation member (heat dissipation resin layer 24) capable of filling the gap t1 with a thickness capable of forming a space portion 28 between with the substrate 12. At least a portion of the side face 14b of the electronic component 14 faces the space portion 28. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5779065(B2) 申请公布日期 2015.09.16
申请号 JP20110215022 申请日期 2011.09.29
申请人 发明人
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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