发明名称 基板処理装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can prevent wet residue of processing liquid from occurring on a substrate while improving throughput of the substrate processing apparatus. <P>SOLUTION: In a rear surface processing section, a drying process is performed after a cleaning process is performed by supplying processing liquid to a substrate W. Thereafter, a main transport robot transports the substrate W from the rear surface processing section to a first turn over unit 23 disposed above a second turn over unit. In the first turn over unit 23, when the substrate W is turned over from the rear surface to the front surface, a downflow from a filter fan unit 52 is started, and heating devices 50 respectively disposed above and below a turn over mechanism perform a heating process with respect to the substrate W. When the turnover action and the drying process of the substrate W are terminated, the main transport robot unloads the substrate W from the first turn over unit 23. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5778944(B2) 申请公布日期 2015.09.16
申请号 JP20110038224 申请日期 2011.02.24
申请人 发明人
分类号 H01L21/304;H01L21/677 主分类号 H01L21/304
代理机构 代理人
主权项
地址