| 摘要 |
A ceramic substrate is provided that includes a ceramic substrate main body having a principal surface, and a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder. The connecting terminal portion includes a copper layer and a coating metal layer covering a surface of the copper layer. The ceramic substrate includes a contact layer disposed between the ceramic substrate main body and the copper layer. The contact layer includes one of a nickel-chromium alloy, chromium, molybdenum, and palladium, and is set back from a side surface of the copper layer in a substrate plane direction. |
