| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connection structure which is superior in low-temperature connectivity and also is superior in connection reliability when circuit base materials are electrically connected, and to provide a manufacturing method therefor. <P>SOLUTION: The method of manufacturing the connection structure includes electrically connecting a first connection terminal in a first circuit member having the first connection terminal with a second connection terminal in a second circuit member having the second connection terminal through an anisotropic conductive adhesive film. The method of manufacturing the connection structure includes using a film substrate having a glass-transition temperature of 100-200°C for at least one of the first circuit member and the second circuit member, the anisotropic conductive adhesive film containing an adhesive component and conductive particles, and the adhesive component containing a cationic polymerizable substance, a sulfonium salt, and polyester resin having a solubility parameter of 8-11 and tensile breaking elongation of 20% or more. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
