发明名称 |
METHOD FOR BONDING BARE CHIP DIES |
摘要 |
<p>A method is provided for assembly of a micro-electronic component comprising the steps of: providing a conductive die bonding material comprising of a conductive thermosettable resin material or flux based solder and a dynamic release layer adjacent to the conductive thermoplastic material die bonding material layer; and impinging a laser beam on the dynamic release layer adjacent to the die bonding material layer; in such a way that the dynamic release layer is activated to direct conductive die bonding material matter towards the pad structure to be treated to cover a selected part of the pad structure with a transferred conductive die bonding material; and wherein the laser beam is restricted in timing and energy, in such a way that the die bonding material matter remains thermosetting. Accordingly adhesive matter can be transferred while preventing that the adhesive is rendered ineffective by thermal overexposure in the transferring process.</p> |
申请公布号 |
EP2917931(A1) |
申请公布日期 |
2015.09.16 |
申请号 |
EP20130801876 |
申请日期 |
2013.11.08 |
申请人 |
NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO;IMEC VZW |
发明人 |
SMITS, EDSGER CONSTANT PIETER;PERINCHERY, SANDEEP MENON;VAN DEN BRAND, JEROEN;MANDAMPARAMBIL, RAJESH;SCHOO, HARMANNUS FRANCISCUS MARIA |
分类号 |
H01L21/60;B23K3/06;B23K35/26;C09J9/02;H01L21/48;H01L21/683;H01L23/00;H01L23/485;H01L23/498;H01L33/62 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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