THE SLURRY INJECTION NOZZLE AND A SUBSTRATE PROCESSING APPARATUS USING THE NOZZLE

摘要

The present invention relates to a slurry injection nozzle and a substrate processing apparatus using the nozzle. The slurry injection nozzle includes: upper and lower bodies which are vertically combined to each other by interposing a process space part for inserting the edge of a process object; a supply port part which mixes compressed air and slurry supplied from the outside; a nozzle which injects the mixture of the compressed air and the slurry of the supply port part to the process space part; and a curtain nozzle which is prepared between an inlet part of the process space part and the nozzle, and forms a fluid curtain. The present invention removes the edge and a lower adhesive layer of a process wafer by injecting a mixture of air and slurry, thereby preventing the generation of particles due to the adhesive layer in a post process. The deterioration of yield can be prevented.