发明名称 素子搭載基板の製造方法
摘要 <P>PROBLEM TO BE SOLVED: To provide means securing insulation between electrodes and making a substrate into pieces. <P>SOLUTION: An element loading substrate frame 1 includes: a plurality of tie bars 30 formed in a matrix shape; an element loading section 2 and an electrode section 3, which are arranged inside the tie bar; an element connection section 20; an electrode connection section 21; and a fixing section 4 which fixes the element loading section, the electrode section and the connection sections and is formed of insulating resin. The manufacturing method of the individual element loading substrates includes cutting the frame 1 by matrix-like cutting lines which have the same vertical and lateral intervals as the matrix-like tie bars and become parallel to the matrix shape. The cutting lines cut all element connecting sections in respective openings or segment all the electrode connecting sections. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5779876(B2) 申请公布日期 2015.09.16
申请号 JP20100284561 申请日期 2010.12.21
申请人 发明人
分类号 H01L23/48;H01L33/62 主分类号 H01L23/48
代理机构 代理人
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